The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Jun. 18, 2019
Renesas Electronics Corporation, Tokyo, JP;
Toshihiko Akiba, Tokyo, JP;
Kenji Sakata, Tokyo, JP;
Nobuhiro Kinoshita, Tokyo, JP;
Yosuke Katsura, Tokyo, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
Reliability of a semiconductor device is improved. The semiconductor device PKGincludes a wiring substrate SUB, a semiconductor chip CHPand a capacitor CDC mounted on the upper surfaceof the wiring substrate SUB, and a lid LD formed of a metallic plate covering the semiconductor chip CHPand the wiring substrate SUB. The semiconductor chip CHPis bonded to the lid LD via a conductive adhesive layer, and the capacitor CDC, which is thicker than the thickness of the semiconductor chip CHP, is disposed in the cut off portionprovided in the lid LD, and is exposed from the lid LD.