The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Dec. 11, 2019
Applicant:

Murata Manufacturing Co., Ltd., Kyoto-fu, JP;

Inventors:

Masahiro Shibata, Nagaokakyo, JP;

Atsushi Kurokawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 29/417 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 29/737 (2006.01); H01L 29/205 (2006.01); H01L 27/082 (2006.01); H01L 29/08 (2006.01); H01L 29/423 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 23/367 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 24/11 (2013.01); H01L 27/0823 (2013.01); H01L 29/205 (2013.01); H01L 29/41708 (2013.01); H01L 29/7371 (2013.01); H01L 29/0847 (2013.01); H01L 29/42304 (2013.01); H01L 29/452 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13084 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10337 (2013.01); H01L 2924/10338 (2013.01); H01L 2924/13051 (2013.01);
Abstract

Transistors including semiconductor regions where operating current flows are provided above a substrate. Operating electrodes of conductive material having thermal conductivity higher than the semiconductor regions and contacting the semiconductor regions to conduct operating current to the semiconductor regions are disposed. A conductor pillar for external connection contains contact regions where the semiconductor regions and the operating electrodes contact, and is electrically connected to the operating electrodes. The contact regions are disposed in a first direction. Each contact region has a planar shape long in a second direction orthogonal to the first direction. A first average distance, obtained by averaging distances in the second direction from each end portion of the contact region in the second direction to an edge of the conductor pillar across the contact regions, exceeds an average distance value in a height direction from the contact region to a top surface of the conductor pillar.


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