The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Sep. 05, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Han Ul Lee, Suwon-si, KR;
Young Gwan Ko, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package includes a frame having a cavity and having a wiring structure connecting first and second surfaces opposing each other; a connection structure disposed on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a semiconductor chip disposed in the cavity and having a connection pad connected to the first redistribution layer; an encapsulant encapsulating the semiconductor chip; and a second redistribution layer having a redistribution pattern and a connection via connecting the wiring structure and the redistribution pattern. The connection via includes a first via connected to the wiring structure and a second via disposed on the first via and connected to the redistribution pattern, a lower surface of the second via has an area larger than an area of an upper surface of the first via.