The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Feb. 26, 2020
Infineon Technologies Austria Ag, Villach, AT;
Gerhard Noebauer, Villach, AT;
Ashita Mirchandani, Torrance, CA (US);
Infineon Technologies Austria AG, Villach, AT;
Infineon Technologies Americas Corp., El Segundo, CA (US);
Abstract
In an embodiment, a semiconductor package includes at least one die pad, a plurality of outer contacts, a first semiconductor device and a second semiconductor device. The second semiconductor device includes a first transistor device having a source electrode, a gate electrode, a drain electrode, a front surface, and a rear surface. A front metallization is positioned on the front surface and a rear metallization on the rear surface of the second semiconductor device. The front metallization includes a first power contact pad coupled to the source electrode and mounted on the at least one die pad. The rear metallization includes a second power contact pad electrically coupled to the drain electrode, and an auxiliary lateral redistribution structure electrically insulated from the second power contact pad and the drain electrode. The first semiconductor device is electrically coupled to the auxiliary lateral redistribution structure.