The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Sep. 04, 2018
The Provost, Fellows, Foundation Scholars, & the Other Members of Board, of the College of the Holy & Undiv. Trinity of Queen Elizabeth Near Dublin, Dublin, IE;
Anthony James Robinson, County Meath Laytown, IE;
Rocco Lupoi, Dublin, IE;
Other;
Abstract
A thermal structure for dissipating heat from a semiconductor substrate has a semiconductor substrate having an external surface which may be roughened. An optional base layer comprising aluminium is formed on top of the external surface by a cold spraying process, and a top layer comprising a matrix of copper and diamond is formed above the substrate, and above the base layer if present, by cold spraying a powder mixture of copper and diamond particles. The top layer is thereby created as a matrix of copper formed by the deformation of the copper particles on impact with the underlying surface and a dispersed phase comprising the diamond particles embedded within the copper matrix. The resulting structure has high thermal conductivity and a coefficient of thermal expansion that is well matched to the substrate, and eliminates the need for a thermal interface material or paste.