The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Nov. 12, 2019
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Navaneetha Krishnan Subbaiyan, Portland, OR (US);
William Richard Trutna, Atherton, CA (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/15 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 23/15 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 23/147 (2013.01);
Abstract
A method of forming an article, including: inserting a conductive material within a via a wafer, wherein the conductive material comprises a first alloy comprising a first metal and a second metal; and contacting the conductive material with a solution comprising ions of a third metal, wherein the ions of the third metal galvanically displace a portion of the second metal from the first alloy to form a second alloy with the first metal.