The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

May. 03, 2018
Applicant:

Asm Ip Holding B.v., Almere, NL;

Inventors:

Lingyun Jia, Helsinki, FI;

Viljami J. Pore, Helsinki, FI;

Marko Tuominen, Helsinki, FI;

Sun Ja Kim, Helsinki, FI;

Oreste Madia, Leuven, BE;

Assignee:

ASM IP HOLDING B.V., Almere, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01L 21/3065 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02274 (2013.01); C23C 16/40 (2013.01); C23C 16/401 (2013.01); C23C 16/402 (2013.01); C23C 16/4554 (2013.01); C23C 16/45525 (2013.01); C23C 16/45536 (2013.01); C23C 16/45542 (2013.01); H01L 21/0228 (2013.01); H01L 21/02126 (2013.01); H01L 21/02208 (2013.01); H01L 21/02216 (2013.01); H01L 21/3065 (2013.01);
Abstract

Methods for controlling the formation of oxygen containing thin films, such as silicon oxycarbide (SiOC) and silicon oxycarbonitride (SiOCN) thin films, on a substrate in a reaction space are provided. The methods can include at least one plasma enhanced atomic layer deposition (PEALD) cycle including alternately and sequentially contacting the substrate with a silicon precursor that comprises oxygen and a second reactant that does not include oxygen. In some embodiments the plasma power can be selected from a range to achieve a desired step coverage or wet etch rate ratio (WERR) for films deposited on three dimensional features.


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