The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Aug. 12, 2020
Applicant:
Sumida Corporation, Tokyo, JP;
Inventors:
Shinichi Sakamoto, Tokyo, JP;
Douglas James Malcolm, Kingston, CA;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 41/064 (2016.01); H01F 17/04 (2006.01); H01F 27/255 (2006.01); H01F 41/02 (2006.01); H01F 27/02 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 41/064 (2016.01); H01F 17/04 (2013.01); H01F 27/022 (2013.01); H01F 27/24 (2013.01); H01F 27/255 (2013.01); H01F 27/2828 (2013.01); H01F 27/29 (2013.01); H01F 41/02 (2013.01); H01F 41/0246 (2013.01); H01F 2017/048 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49071 (2015.01);
Abstract
A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of an Fe—Si—Cr alloy, a thermosetting resin, and a solvent into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.