The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Aug. 30, 2019
Applicant:

Toshiba Memory Corporation, Tokyo, JP;

Inventors:

Kazuyo Ishii, Kamakura Kanagawa, JP;

Hiroaki Maekawa, Yokohama Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G11C 29/38 (2006.01); H01R 12/70 (2011.01); H01L 21/66 (2006.01); H01L 27/22 (2006.01);
U.S. Cl.
CPC ...
G11C 29/38 (2013.01); H01L 22/30 (2013.01); H01R 12/7076 (2013.01); H01L 27/222 (2013.01);
Abstract

A reliability evaluation apparatus according to the present embodiment is provided with a housing and a board insertable into the housing. A plurality of sockets are provided on the board. Semiconductor devices are respectively attachable to socket. The plurality of sockets have electrodes electrically connectable to terminals of the semiconductor devices. A heater is provided inside the housing. A controller is connected to the plurality of sockets and to the heater. The controller controls a voltage to be applied to the terminal of the semiconductor device and controls an output of the heater. A plurality of electromagnets are arranged inside the housing so as to be positioned above or below the plurality of sockets when the board is inserted into the housing.


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