The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Jan. 26, 2020
Applicant:

Mellanox Technologies Tlv Ltd., Ra'anana, IL;

Inventors:

Guy Lederman, Rishon LeZion, IL;

Ran Ravid, Tel Aviv, IL;

Asaf Horev, Rishon LeZion, IL;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 13/40 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4063 (2013.01);
Abstract

A Multi-Chip-Module (MCM) includes an MCM substrate and at least a data producing IC (DPIC) and a data-consuming IC (DCIC), both mounted on the MCM substrate and connected to one another through a high-speed bus having a fixed data rate. The DPIC is configured to send data to the DCIC by alternating between (i) first time periods during which the DPIC sends over the bus both produced data and dummy data that together have the fixed data rate of the bus, and (ii) second time periods during which the DPIC sends over the bus only dummy data at the fixed data rate, wherein a rate of the produced date and durations of the first time periods and the second time periods, are preset.


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