The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Apr. 13, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tetsushi Oohori, Tokyo, JP;

Toshihide Otsuka, Tokyo, JP;

Ryo Senoo, Fukuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); H05K 13/02 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41865 (2013.01); H05K 13/02 (2013.01); H05K 13/021 (2013.01); H05K 13/08 (2013.01); G05B 2219/31376 (2013.01); G05B 2219/32252 (2013.01); G05B 2219/45029 (2013.01); G05B 2219/45031 (2013.01); Y02P 90/02 (2015.11);
Abstract

A material management apparatus (management computer) includes a production plan acquirer that acquires production plan information including a type of a material (cream solder) for bonding a component to a substrate, the material being used for production of a mounting substrate obtained by mounting the component on the substrate; a material status acquirer that acquires material status information on the material preserved in a material preservatory which preserves an accommodating portion (solder pot) in which the material is accommodated; and a material preparation instructor that creates and transmits an instruction to prepare the accommodating portion to be put out from the material preservatory, based on the production plan information and the material status information.


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