The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Apr. 06, 2017
Applicant:

Sabic Global Technologies B.v., Bergen op Zoom, NL;

Inventors:

Zahir Bashir, Riyadh, SA;

Hao Gu, Bergen op Zoom, NL;

Assignee:

SABIC GLOBAL TECHNOLOGIES B.V., Bergen op Zoom, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 63/183 (2006.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B29C 64/153 (2017.01); B29C 64/35 (2017.01); B33Y 80/00 (2015.01); B29K 67/00 (2006.01); B29K 509/02 (2006.01); B29K 509/10 (2006.01);
U.S. Cl.
CPC ...
C08G 63/183 (2013.01); B29C 64/153 (2017.08); B29C 64/35 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B29K 2067/003 (2013.01); B29K 2509/02 (2013.01); B29K 2509/10 (2013.01); B33Y 80/00 (2014.12); C08G 2250/00 (2013.01);
Abstract

A polymer powder composition for production of shaped objects via selective laser sintering includes a thermoplastic material, which is a polyester, wherein the powder has specific particles size distribution. The thermoplastic material has: has a crystallization half time of >30 s and <12 min at a supercooling of 50° C. below the peak melt temperature; a glass transition temperature Tg of >50° C.; a peak melt temperature Tp,m of >200° C.; an extrapolated first heating run melt onset temperature T ei,m of >5° C. above the extrapolated first cooling run crystallization end temperature Tef,c; and a degree of crystallinity of >10.0%. The polymer composition has a continuous use temperature of >100° C., and a low change of molecular weight during exposure to selective laser sintering processing temperatures.


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