The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Sep. 14, 2017
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventor:
Si-lam Choy, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/165 (2006.01);
U.S. Cl.
CPC ...
B41J 2/16535 (2013.01);
Abstract
A fluid ejection device includes a fluid ejection assembly including a fluid ejection die, and a service assembly to be rotated to different positions relative to the fluid ejection assembly for different service operations of the fluid ejection die.
Quick Actions:
Choy, Si-lam. (2021). Rotatable service assembly for fluid ejection die (U.S. Patent No. 11155094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11155094
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile