The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Jan. 08, 2019
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Manabu Otsuka, Kawasaki, JP;

Tamaki Sato, Kawasaki, JP;

Tetsushi Ishikawa, Tokyo, JP;

Yasuaki Tominaga, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/14 (2006.01); G03F 7/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B41J 2/14145 (2013.01); B41J 2/1603 (2013.01); B41J 2/164 (2013.01); B41J 2/1626 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1631 (2013.01); B41J 2/1639 (2013.01); G03F 7/161 (2013.01);
Abstract

A method of producing a structure having a through substrate includes: forming a protective member having an atmosphere communication layer having a structure communicating with the through hole by permeation from at least a part of a layer side surface part to the through hole, and a gas-impermeable protective layer in this order, on the second surface of the through substrate; forming a dry film resist layer having a resin layer and a support member in this order, on the first surface of the through substrate; and peeling the support member from the resin layer, the support member being peeled from the resin layer in a state that the through hole of the through substrate is communicated with atmosphere by at least the atmosphere communication layer, in the peeling.


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