The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Apr. 18, 2016
Applicants:

Discma Ag, Hunenberg, CH;

Shinichi Tabata, Kanagawa, JP;

Mitsuru Shiokawa, Kanagawa, JP;

Inventors:

Shinichi Tabata, Kanagawa, JP;

Mitsuru Shiokawa, Kanagawa, JP;

Assignee:

Discma AG, Zürich, CH;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 49/46 (2006.01); B29C 49/42 (2006.01); B29C 49/78 (2006.01); B29C 49/12 (2006.01); B29C 49/58 (2006.01); B29C 49/06 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 49/46 (2013.01); B29C 49/421 (2013.01); B29C 49/783 (2013.01); B29C 49/06 (2013.01); B29C 49/12 (2013.01); B29C 2049/4664 (2013.01); B29C 2049/5803 (2013.01); B29L 2031/7158 (2013.01);
Abstract

A liquid blow molding apparatus for liquid blow molding a resin preform into a container having a prescribed shape. The apparatus includes a blow molding mold in which the preform is disposed; a blow nozzle that engages in an opening of the preform; a pressurized liquid supply that supplies a pressurized liquid to a supply path that is connected to the blow nozzle; and a seal member that is provided inside the supply path and opens and closes the supply path with respect to the blow nozzle. The pressurized liquid supply is configured to start supplying the pressurized liquid to the supply path after the seal member has begun to open.


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