The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Jul. 19, 2019
Seiko Epson Corporation, Tokyo, JP;
Kenta Anegawa, Matsumoto, JP;
Seiichiro Yamashita, Azumino, JP;
Kei Yokota, Matsumoto, JP;
Mitsuru Inutsuka, Kawagoe, JP;
Yusuke Watanabe, Shiojiri, JP;
Kakeru Sasagawa, Matsumoto, JP;
Yuichi Sasage, Suwa, JP;
Abstract
An injection molding apparatus includes an injection-molding mold including a fixed mold and a movable mold, the fixed mold having a gate opening into which a molding material flows, the movable mold having a cavity and being configured to be separated from the fixed mold during mold opening; a hot runner including a nozzle having a channel that guides the molding material to the gate opening, and a heater, the hot runner being disposed in the fixed mold; and a control unit that controls a temperature of the heater to adjust a temperature of the hot runner. The control unit controls the temperature of the heater to a first temperature when the molding material is injected from the hot runner to the cavity, and after the injection of the molding material is completed, controls the temperature of the heater to a second temperature that is higher than the first temperature.