The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 26, 2021

Filed:

Jan. 23, 2019
Applicant:

Korea Institute of Science and Technology, Seoul, KR;

Inventors:

Ji Young Byun, Seoul, KR;

Sang Hoon Kim, Seoul, KR;

Jong Sik Kim, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 35/04 (2006.01); B01J 23/86 (2006.01); B01J 37/08 (2006.01); B01J 37/02 (2006.01); B01J 21/02 (2006.01); B01J 35/00 (2006.01); F01N 3/00 (2006.01);
U.S. Cl.
CPC ...
B01J 35/04 (2013.01); B01J 21/02 (2013.01); B01J 23/862 (2013.01); B01J 35/002 (2013.01); B01J 37/023 (2013.01); B01J 37/0225 (2013.01); B01J 37/0228 (2013.01); B01J 37/08 (2013.01); F01N 3/00 (2013.01);
Abstract

A method of manufacturing a honeycomb metal structure includes providing a substrate comprising iron (Fe) and a container containing water; coating at least a part of the substrate with a viscid material whose viscidity is increased by moisture; attaching metal powder onto the viscid material; adhering the metal powder to the substrate due to an increase in viscidity of the viscid material by evaporating a portion of the water in the container and supplying moisture to the viscid material; and generating an uneven structure made of the metal powder bonded to the substrate by performing a heat treatment on the substrate to which the metal powder is adhered. The heat treatment may include performing a first heat treatment on the substrate to generate an intermetallic layer at an interface between the substrate and the metal powder; and performing a second heat treatment to dissolve the intermetallic compound layer.


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