The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Mar. 13, 2020
Applicants:

Autonetworks Technologies, Ltd., Mie, JP;

Sumitomo Wiring Systems, Ltd., Mie, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Yu Muronoi, Yokkaichi, JP;

Naomichi Kawashima, Yokkaichi, JP;

Masayuki Kato, Yokkaichi, JP;

Takeo Uchino, Yokkaichi, JP;

Akihiko Matsuoka, Yokkaichi, JP;

Tatsuo Hirabayashi, Yokkaichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); B29C 45/14 (2006.01); H05K 1/11 (2006.01); H05K 5/06 (2006.01); H05K 5/02 (2006.01); H05K 5/00 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); B29C 45/14 (2013.01); H01R 12/722 (2013.01); H05K 1/11 (2013.01); H05K 5/0034 (2013.01); H05K 5/02 (2013.01); H05K 5/064 (2013.01);
Abstract

A connector device that includes a circuit board; a connector attached to the circuit board; a plurality of collars for external attachment; a first molded resin that is made of a first resin material whose melting point or softening point is 230° C. or less, and covers the entire circuit board and part of the connector; and a second molded resin that is welded to the first molded resin, is made of a second resin material whose melting point or softening point is higher than that of the first resin material for the first molded resin, and covers outer circumferences of the collars.


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