The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Aug. 27, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Shinichiro Banba, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A high-frequency module () includes a component () mounted on an upper surface () of a substrate (), a second sealing resin layer () stacked on the upper surface () of the substrate (), a component () mounted on a lower surface () of the substrate (), a first sealing resin layer () stacked on the lower surface () of the substrate (), and a first terminal assembly () and a second terminal assembly () that are mounted on the lower surface () of the substrate (). The first terminal assembly () is mounted on a four-corner portion of the substrate () and includes a connection conductor () thicker than a connection conductor () of the second terminal assembly ().