Integrated vapor chamber printed circuit board (pcb) assembly

Abstract

A circuit card assembly (CCA) is disclosed. In embodiments, the CCA includes a printed circuit board (PCB) comprising a series of adjacent substrate layers. Evaporator layers include an evaporator surface thermally connected to CCA components and capable of absorbing heat therefrom. A series of wall layers include apertures collectively defining an integrated vapor chamber extending between the evaporator layers and condenser layers including a condenser surface opposite the evaporator surface. A working fluid within the vapor chamber is boiled by heat transferred from the evaporator surface and re-condenses at the condenser surface, which transfers heat from the working fluid. The re-condensed working fluid is transitioned back to the evaporator surface via capillary wick structures within the internal surfaces of vapor chamber.