The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Mar. 05, 2018
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Yoshinobu Kimura, Tokyo, JP;

Kazuki Tani, Tokyo, JP;

Takashi Ogawa, Tokyo, JP;

Hiroshi Suzuki, Tokyo, JP;

Junichi Sakano, Tokyo, JP;

Assignee:

HITACHI, LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02P 29/68 (2016.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H02P 29/68 (2016.02); H02P 27/08 (2013.01);
Abstract

A temperature abnormality of the power module is accurately detected. A power conversion device including a power semiconductor module with a switching element, includes: a gate driver circuit configured to drive a switching element and transmitting a response signal upon a switching operation of the switching element; a control unit device configured to output to a gate driver circuit an instruction signal for switching; a temperature detection unit configured to calculate a bonding temperature of the switching element based on a response signal to the instruction signal; and a calculation unit configured to determine a state of a power semiconductor module according to a bonding temperature calculated by the temperature detection unit and the response signal.


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