The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
May. 24, 2019
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Inventors:
Penghao Gu, Beijing, CN;
Chunyan Xie, Beijing, CN;
Lingzhi Qian, Beijing, CN;
Jiahao Zhang, Beijing, CN;
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/52 (2006.01); H01L 51/56 (2006.01); F21Y 105/00 (2016.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 51/5209 (2013.01); H01L 51/56 (2013.01); F21Y 2105/00 (2013.01); H01L 27/3246 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/5369 (2013.01);
Abstract
A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.