The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11152557 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 19, 2021

Filed:

May. 20, 2019
Applicant:

Gentherm Incorporated, Northville, MI (US);

Inventors:

Vladimir Jovovic, Ann Arbor, MI (US);

Eric Poliquin, Claremont, CA (US);

Ellen M. Heian, Glendora, CA (US);

Assignee:

GENTHERM INCORPORATED, Northville, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/32 (2006.01); H05K 1/02 (2006.01); H01L 35/34 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 35/34 (2013.01); H05K 1/0201 (2013.01); H05K 2201/10219 (2013.01);
Abstract

A thermoelectric module assembly for thermally conditioning a component is includes first and second heat spreaders spaced apart from one another and at least one thermoelectric sub-assembly between and in thermal communication with the first and second heat spreaders. The at least one thermoelectric sub-assembly includes a plurality of thermoelectric devices and a printed circuit board having a plurality of electrical conduits. Each of the thermoelectric devices has a first end portion and a second end portion, the second end portion opposite from the first end portion, the first end portion mechanically coupled to the printed circuit board and in electrical communication with the plurality of electrical conduits, and the second end portion spaced from the printed circuit board.


Find Patent Forward Citations

Jovovic, Vladimir. (2021). Thermoelectric module with integrated printed circuit board (U.S. Patent No. 11152557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11152557

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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