The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Apr. 16, 2019
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Min-Hsin Lo, Miao-Li County, TW;

Ker-Yih Kao, Miao-Li County, TW;

Ming-Chun Tseng, Miao-Li County, TW;

Hung-Sheng Liao, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/10 (2013.01); H01L 24/81 (2013.01); H01L 27/153 (2013.01); H01L 2224/0401 (2013.01);
Abstract

The present disclosure provides an electronic device providing a substrate, a first circuit, a plurality of bonding pads and a light emitting unit. The first circuit is disposed on the substrate. The bonding pads are disposed on the substrate, wherein at least one of the bonding pads includes a bonding part and a connecting part, and the bonding part is electrically connected to the first circuit through the connecting part. The light emitting unit is disposed on the substrate and corresponding to the bonding part, and the light emitting unit is electrically connected to the first circuit through at least one of the bonding pads. At least a portion of the first circuit is located between two of the bonding pads in a top view.


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