Method of manufacturing driven element chip, driven element chip, exposing device, and image forming apparatus

Abstract

One of embodiments is a method of manufacturing driven element chips by dividing a semiconductor wafer into the driven element chips. The method includes preparing a semiconductor wafer which includes chip substrate portions arrayed in an array direction, and a clearance between the chip substrate portions adjacent to each other in the array direction. Each chip substrate portion includes: a conductive layer provided inside the chip substrate portion and including interconnect portions; and a dummy conductor provided in a part of the conductive layer where the interconnect portions are not provided.