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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11152525 B1

PDFFull Text
Date of Patent:
Oct. 19, 2021

Filed:

May. 22, 2018

Solar cell module

Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Joonhan Kwon, Seoul, KR;

Hyeyoung Yang, Seoul, KR;

Bojoong Kim, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Jayne L Mershon

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/28 (2006.01); H01L 29/94 (2006.01); H01L 29/78 (2006.01); H01L 31/05 (2014.01); H01L 31/0224 (2006.01); H01L 31/048 (2014.01); H01L 31/068 (2012.01); H01L 31/0216 (2014.01); H01L 31/049 (2014.01);
U.S. Cl.
CPC ...
H01L 31/0516 (2013.01); H01L 31/0216 (2013.01); H01L 31/02167 (2013.01); H01L 31/02245 (2013.01); H01L 31/022458 (2013.01); H01L 31/049 (2014.12); H01L 31/0481 (2013.01); H01L 31/0512 (2013.01); H01L 31/0682 (2013.01); Y02E 10/547 (2013.01); Y10T 29/49355 (2015.01);
Abstract

A solar cell module includes solar cells each including a semiconductor substrate and first and second electrodes that extend in a first direction on a surface of the semiconductor substrate and have different polarities; conductive lines extended in a second direction crossing the first direction on the surface of the semiconductor substrate included in each solar cell and connected to the first electrodes or the second electrodes through a conductive adhesive; and an insulating adhesive portion extending in the first direction on at least a portion of the surface of the semiconductor substrate, on which the conductive lines are disposed, and temporarily fixing the conductive lines to the semiconductor substrate and the first and second electrodes, the insulating adhesive portion being attached on a back surface of least a portion of each conductive line as well as a side surface of at least a portion of each conductive line.

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