The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Apr. 13, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Stanley Seungchul Song, San Diego, CA (US);

Kern Rim, San Diego, CA (US);

John Jianhong Zhu, San Diego, CA (US);

Da Yang, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/48 (2006.01); H03K 3/3562 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); H01L 23/481 (2013.01); H01L 27/11807 (2013.01); H03K 3/35625 (2013.01);
Abstract

Cell circuits formed in circuit cells employing offset gate cut areas in a non-active area for routing transistor gate cross-connections. In exemplary aspects disclosed herein, to allow cross-connections to be made across different gates between PMOS and NMOS transistors formed in the circuit cell, cut areas in the circuit cell are located in different horizontal routing tracks and offset from each other in the direction of longitudinal axes of gates. Gate cross-connections can be routed around offset gate cut areas and coupled to active gates to form gate cross-connections. In this manner, fewer metal layers may be required to provide such cross-connections in the circuit cell, thus reducing area. Further, gate contacts of cross-connected gates can be formed as gate contacts over active areas (GCOAs) in diffusion areas of the circuit cell, thus facilitating easier routing of interconnections in non-diffusion area of the circuit cell for further ease of routing.


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