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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11152340 B1

PDFFull Text
Date of Patent:
Oct. 19, 2021

Filed:

Apr. 05, 2017

Power module having a multilayered structure with liquid cooled busbar and method for manufacturing same

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Roberto Mrad, Rennes, FR;

Stefan Mollov, Rennes, FR;

Jeffrey Ewanchuk, Rennes, FR;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Ajay Arora

Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 23/473 (2006.01); H01L 23/64 (2006.01); H01L 21/48 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4882 (2013.01); H01L 23/473 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 25/50 (2013.01); H05K 1/185 (2013.01); H05K 1/0231 (2013.01); H05K 1/0233 (2013.01); H05K 3/4602 (2013.01); H05K 2201/10166 (2013.01);
Abstract

The present invention concerns a power module comprising at least one power die, the at least one power die is embedded in a multilayer structure, the multilayer structure is an assembly of at least two sub-modules, each sub-module being formed of isolation and conductor layers and the power module further comprises at least one capacitor embedded in the multilayer structure for decoupling an electric power supply to the at least one power die embedded in the multilayer structure and at least one driving circuit of the at least one power die that is disposed on a surface of the multilayer structure or embedded completely or partially in the multilayer structure.

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