The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Sep. 05, 2019
Toshiba Memory Corporation, Minato-ku, JP;
Yusuke Tanaka, Kawasaki, JP;
Atsushi Hieno, Yokohama, JP;
Tsutomu Nakanishi, Yokohama, JP;
Yasuhito Yoshimizu, Yokkaichi, JP;
Masayoshi Tagami, Kuwana, JP;
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Abstract
In one embodiment, a semiconductor device includes a first chip that includes a first interconnect layer, a first insulator provided on the first interconnect layer, a first metal portion provided on the first interconnect layer and provided in the first insulator and including at least one of palladium, platinum and gold, and a second interconnect layer provided on the first metal portion and provided in the first insulator. The device further includes a second chip that includes a second insulator provided on the first insulator, and a third interconnect layer provided in the second insulator and provided on the second interconnect layer.