The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Sep. 04, 2019
Toshiba Memory Corporation, Minato-ku, JP;
Eiichi Soda, Nagoya, JP;
TOSHIBA MEMORY CORPORATION, Minato-ku, JP;
Abstract
A method of an embodiment separates a bonded substrate including first and second substrates. The bonded substrate includes a carbon film on a first surface of the first substrate, a memory cell on the carbon film, a first connection terminal on the memory cell, a transistor on a first surface of the second substrate, and a second connection terminal on the transistor. In opposing direction of the first surfaces of the first and second substrates, a side of the first substrate on which the memory cell is located and a side of the second substrate on which the transistor is located are joined together, and the first and second connection terminals are mutually connected. The method includes removing the carbon film, and separating the bonded substrate into the first substrate with the first surface exposed and the second substrate on which the memory cell and the transistor are located.