The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Oct. 03, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Roxanna Bauzon Samson, Benguet, PH;
Ruby Ann Maya Merto, Baguio, PH;
Lorraine Rivera Duldulao, San Fernando Pampanga, PH;
Jason Binay-an Colte, Benguet, PH;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); H01L 21/4839 (2013.01); H01L 23/49524 (2013.01); H01L 23/49537 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 24/38 (2013.01); H01L 24/40 (2013.01); H01L 24/41 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 2224/2741 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01);
Abstract
A method of making a plurality of integrated circuit ('IC') packages includes picking up a plurality of physically unconnected IC components; and simultaneously placing each of the physically unconnected IC components on corresponding portions of an unsingulated IC package strip that includes a sheet of integrally connected leadframes.
Samson, Roxanna. (2021). Method and apparatus for making integrated circuit packages (U.S. Patent No. 11152324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11152324
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile