The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Apr. 05, 2019
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Tian Huang, Painted Post, NY (US);

Mandakini Kanungo, Painted Post, NY (US);

Ekaterina Aleksandrovna Kuksenkova, Painted Post, NY (US);

Prantik Mazumder, Ithaca, NY (US);

Chad Byron Moore, Corning, NY (US);

Chukwudi Azubuike Okoro, Corning, NY (US);

Ah-Young Park, Corning, NY (US);

Scott Christopher Pollard, Big Flats, NY (US);

Rajesh Vaddi, Corning, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/48 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); C03C 15/00 (2006.01); C23C 18/38 (2006.01); H01L 21/768 (2006.01); H05K 3/38 (2006.01); C23C 14/18 (2006.01); C23C 28/02 (2006.01); C03C 17/06 (2006.01); C03C 3/06 (2006.01); C03C 23/00 (2006.01); C03C 17/00 (2006.01); H05K 3/42 (2006.01); C25D 7/12 (2006.01); C03C 3/076 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); C03C 3/06 (2013.01); C03C 15/00 (2013.01); C03C 17/06 (2013.01); C03C 23/0025 (2013.01); C23C 14/18 (2013.01); C23C 18/38 (2013.01); C23C 28/02 (2013.01); H01L 21/76877 (2013.01); H01L 23/15 (2013.01); H01L 23/481 (2013.01); H01L 23/49838 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 3/388 (2013.01); C03C 3/076 (2013.01); C25D 7/123 (2013.01); H01L 21/486 (2013.01); H01L 23/4924 (2013.01); H01L 23/49866 (2013.01); H01L 23/564 (2013.01); H05K 3/002 (2013.01); H05K 3/0029 (2013.01); H05K 3/0055 (2013.01); H05K 3/423 (2013.01); H05K 3/425 (2013.01); H05K 3/428 (2013.01); H05K 2201/068 (2013.01); H05K 2201/0989 (2013.01); H05K 2201/09545 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10378 (2013.01); H05K 2203/1194 (2013.01); H05K 2203/1361 (2013.01); H05K 2203/143 (2013.01); H05K 2203/1438 (2013.01); H05K 2203/162 (2013.01); Y10T 428/24273 (2015.01); Y10T 428/24479 (2015.01); Y10T 428/24851 (2015.01); Y10T 428/24917 (2015.01); Y10T 428/24926 (2015.01);
Abstract

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.


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