The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Nov. 15, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sunghawn Bae, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
The present invention provides a fan-out semiconductor package, and the fan-out semiconductor package includes a semiconductor chip, an encapsulant covering the semiconductor chip, a connection structure disposed below the semiconductor chip and including a redistribution layer, and first and second metal pattern layers disposed on different levels on the semiconductor chip. The first metal pattern layer is to electrically connect to an electrical connection member such as a frame, provided for electrical connection of the fan-out semiconductor package in a vertical direction through a path via the second metal pattern layer.