The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Nov. 06, 2019
Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material
Applicant:
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Inventors:
Louis-Michel Collin, Grenoble, FR;
Jean-Philippe Colonna, Grenoble, FR;
Perceval Coudrain, Grenoble, FR;
Luc Frechette, Grenoble, FR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/56 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/568 (2013.01); H01L 23/473 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01047 (2013.01);
Abstract
A method for manufacturing a cooling circuit on at least one integrated circuit chip includes producing a cooling circuit on a first face of the chip. Producing the cooling circuit includes forming a definition pattern of the cooling circuit on the first face of the chip, the pattern having at least one layer of a sacrificial material; coating the pattern with at least one resin layer; and at least partially removing the sacrificial material from the pattern so as to open the cooling circuit.