The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Nov. 14, 2019
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Issei Yamamoto, Kyoto, JP;

Kunihiro Miyahara, Kyoto, JP;

Yoshihito Otsubo, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/40 (2006.01); H03H 7/01 (2006.01); H01F 27/36 (2006.01); H01G 4/12 (2006.01); H01G 4/30 (2006.01); H01G 2/24 (2006.01); H01F 17/00 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01G 4/40 (2013.01); H01F 17/0013 (2013.01); H01F 27/36 (2013.01); H01G 2/24 (2013.01); H01G 4/12 (2013.01); H01G 4/30 (2013.01); H03H 7/1741 (2013.01); H03H 2001/0085 (2013.01);
Abstract

Provided is a stacked electronic component having: a stacked bodyin which ceramic layerstoare stacked, the stacked body having an a upper surface U and side surfaces S; at least one recess portionformed on the upper surface U that indicates at least one of a mark, a letter, or a number; electrodesformed between the layers of the stacked body; and a shield layerformed on the upper surface U and the side surfaces S of the stacked body. Right below an inner bottom surface of the recess portionof the stacked body, there is provided a no-electrode region NE in which the electrodesare not formed, the no-electrode region NE having a thickness which is equal to or larger than a depth of the recess portion


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