The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Mar. 16, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Yuichi Nagai, Tokyo, JP;

Atsushi Takeda, Tokyo, JP;

Takehisa Tamura, Tokyo, JP;

Shinya Onodera, Tokyo, JP;

Assignee:

TDK CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/232 (2006.01); H01G 4/248 (2006.01); H01G 4/30 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01);
Abstract

An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of2/1≥0.11,and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of3/1≥0.11.


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