The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Oct. 10, 2018
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Kyoung Jin Cha, Suwon-si, KR;
Jeong Ryeol Kim, Suwon-si, KR;
Kyung Ryul Lee, Suwon-si, KR;
Young Joon Oh, Suwon-si, KR;
Hyo Min Kang, Suwon-si, KR;
Jun Oh Kim, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.