The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Apr. 11, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Boksoon Kwon, Suwon-si, KR;
Youngsuk Jung, Suwon-si, KR;
Heechul Jung, Gunpo-si, KR;
Eunha Lee, Seoul, KR;
Seongho Jeon, Yongin-si, KR;
Sungsoo Han, Hwaseong-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 3/14 (2006.01); H01M 10/42 (2006.01); G01N 3/20 (2006.01); G01N 3/26 (2006.01); H02J 7/00 (2006.01);
U.S. Cl.
CPC ...
G01N 3/14 (2013.01); H01M 10/4285 (2013.01); G01N 2203/0033 (2013.01); G01N 2203/0075 (2013.01); G01N 2203/026 (2013.01); H02J 7/0068 (2013.01);
Abstract
An apparatus for measuring a deformation stiffness of an article includes a force measuring means configured to measure a force generated in a thickness direction of the article; a thickness measuring means configured to measure a thickness of the article; and a data processor configured to differentiate force with respect to thickness to calculate the deformation stiffness of the article, wherein each of the force and the thickness are a result of a volume change of the article.