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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11149234 B1

PDFFull Text
Date of Patent:
Oct. 19, 2021

Filed:

Jan. 17, 2019

Cleaning composition, cleaning apparatus, and method of fabricating semiconductor device using the same

Applicants:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Semes Co., Ltd., Cheonan-si, KR;

Inventors:

Mi Hyun Park, Seongnam-si, KR;

Jung-Min Oh, Incheon, KR;

Young-Hoo Kim, Yongin-si, KR;

Hyo San Lee, Hwaseong-si, KR;

Tae Keun Kim, Cheonan-si, KR;

Ye Rim Yeon, Hwaseong-si, KR;

Hae Rim Oh, Cheonan-si, KR;

Ji Soo Jeong, Seoul, KR;

Min Hee Cho, Hwaseong-si, KR;

Assignees:

Samsung Electronics Co., Ltd., Suwon-Si, KR;

Semes Co., Ltd., Cheoman-Si, KR;

Attorney:

Lee IP Law, P.C.

Primary Examiner:

Sharidan Carrillo

Int. Cl.
CPC ...
B08B 3/10 (2006.01); C11D 11/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/02 (2006.01); C11D 17/00 (2006.01); C11D 3/28 (2006.01); C11D 3/20 (2006.01); C11D 3/34 (2006.01); C11D 3/32 (2006.01); C11D 1/14 (2006.01); C11D 1/12 (2006.01); C11D 1/29 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); B08B 3/10 (2013.01); C11D 1/12 (2013.01); C11D 1/146 (2013.01); C11D 1/29 (2013.01); C11D 3/201 (2013.01); C11D 3/2017 (2013.01); C11D 3/2044 (2013.01); C11D 3/2096 (2013.01); C11D 3/28 (2013.01); C11D 3/32 (2013.01); C11D 3/3445 (2013.01); C11D 17/0008 (2013.01); H01L 21/02057 (2013.01); H01L 21/67017 (2013.01); H01L 21/67051 (2013.01); H01L 21/68764 (2013.01);
Abstract

A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.

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