The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Oct. 21, 2016
Wood One Co., Ltd., Hatsukaichi, JP;
Masayoshi Horito, Hatsukaichi, JP;
Naoko Kurushima, Hatsukaichi, JP;
Tomoyuki Matsumae, Hatsukaichi, JP;
Yusho Nakamoto, Hatsukaichi, JP;
Yoshikazu Yazaki, Moorabbin, AU;
WOOD ONE CO., LTD., Hatsukaichi, JP;
Abstract
Provided is an adhesive using bark, which is advantageous not only in that the proportion of the bark is increased so as to effectively utilize the bark, and the proportion of the phenolic resin is reduced to lower the adhesive solids content, but also in that the composition of the adhesive is simple. An adhesive using bark, which comprises a resol type phenolic resin and a radiata pine bark powder, wherein the adhesive contains 30 to 40 parts by mass of the radiata pine bark powder, relative to 100 parts by mass of the total of the resol type phenolic resin solids and the radiata pine bark powder. Alternatively, an adhesive using bark, which comprises a resol type phenolic resin and a radiata pine bark powder, wherein the adhesive contains 20 to 50 parts by mass of the radiata pine bark powder and wheat flour, relative to 100 parts by mass of the total of the resol type phenolic resin solids, the radiata pine bark powder, and the wheat flour, and wherein the mass ratio of the radiata pine bark powder and the wheat flour is 9:1 to 5:5.