The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Mar. 09, 2018
Applicant:

Lg Hausys, Ltd., Seoul, KR;

Inventors:

Hee-Jung Lee, Seoul, KR;

Sung Yong Kang, Seoul, KR;

Kyoung Min Kang, Seoul, KR;

Min Gyung Kim, Seoul, KR;

Chang-Young Park, Seoul, KR;

Jae Ho Lim, Seoul, KR;

Jun Ho Choi, Seoul, KR;

Jae Han Song, Seoul, KR;

Yu Jin Go, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29B 9/10 (2006.01); B01J 2/04 (2006.01); C08J 3/12 (2006.01); C08L 67/04 (2006.01); C08G 63/06 (2006.01); B01J 2/20 (2006.01); B29B 9/12 (2006.01); B29K 67/00 (2006.01);
U.S. Cl.
CPC ...
C08J 3/12 (2013.01); B01J 2/04 (2013.01); B01J 2/20 (2013.01); B29B 9/10 (2013.01); C08G 63/06 (2013.01); C08L 67/04 (2013.01); B29B 2009/125 (2013.01); B29K 2067/046 (2013.01); C08J 2367/04 (2013.01); C08J 2375/04 (2013.01); C08L 2203/30 (2013.01);
Abstract

Provided is a method for manufacturing thermoplastic polymer particles, the method comprising the steps of: supplying a thermoplastic polymer resin to an extruder and extruding the same; supplying the extruded thermoplastic polymer resin and air to a nozzle, bringing the thermoplastic polymer resin into contact with the air to granulate the thermoplastic polymer resin, and then discharging the granulated thermoplastic polymer resin; and supplying discharged thermoplastic polymer particles to a cooling unit to cool the thermoplastic polymer particles, and then collecting the cooled thermoplastic polymer particles.


Find Patent Forward Citations

Loading…