The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Nov. 05, 2015
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Devin A. Mourey, Corvallis, OR (US);
Michael G. Groh, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B81C 99/00 (2010.01); B81C 1/00 (2006.01); B41J 2/155 (2006.01); B01L 3/02 (2006.01);
U.S. Cl.
CPC ...
B81C 99/008 (2013.01); B01L 3/0268 (2013.01); B41J 2/155 (2013.01); B41J 2/1603 (2013.01); B41J 2/1637 (2013.01); B81C 1/00309 (2013.01); B41J 2202/19 (2013.01); B41J 2202/20 (2013.01); B41J 2202/21 (2013.01); B81B 2201/052 (2013.01); B81B 2201/058 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/0338 (2013.01); B81C 2201/0188 (2013.01); B81C 2203/0154 (2013.01);
Abstract
Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.