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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11148401 B1

PDFFull Text
Date of Patent:
Oct. 19, 2021

Filed:

Aug. 03, 2016

Hot-melt adhesive resin film and production method thereof

Applicant:

Fujimori Kogyo Co., Ltd., Tokyo, JP;

Inventors:

Kunihiro Takei, Tokyo, JP;

Yuiko Maruyama, Tokyo, JP;

Hirokazu Iizuka, Tokyo, JP;

Assignee:

FUJIMORI KOGYO CO., LTD., Tokyo, JP;

Attorney:

Hauptman Ham, LLP

Primary Examiner:

Anish P Desai

Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); C09D 123/26 (2006.01); C09D 5/00 (2006.01); C09J 123/26 (2006.01); C09J 201/00 (2006.01); B32B 27/00 (2006.01); C09J 151/06 (2006.01); B32B 37/00 (2006.01); C09J 7/29 (2018.01); C09J 7/35 (2018.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01);
U.S. Cl.
CPC ...
B32B 27/08 (2013.01); B32B 27/00 (2013.01); B32B 27/20 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 27/325 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 37/00 (2013.01); B32B 37/12 (2013.01); B32B 37/185 (2013.01); C09D 5/00 (2013.01); C09D 123/26 (2013.01); C09J 7/29 (2018.01); C09J 7/35 (2018.01); C09J 123/26 (2013.01); C09J 151/06 (2013.01); C09J 201/00 (2013.01); B32B 2250/03 (2013.01); B32B 2250/24 (2013.01); B32B 2250/40 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2270/00 (2013.01); B32B 2307/306 (2013.01); B32B 2307/732 (2013.01); B32B 2323/10 (2013.01); B32B 2325/00 (2013.01); B32B 2363/00 (2013.01); B32B 2367/00 (2013.01); B32B 2377/00 (2013.01); B32B 2405/00 (2013.01); C09J 2301/124 (2020.08); C09J 2301/304 (2020.08); C09J 2301/414 (2020.08); C09J 2423/00 (2013.01); C09J 2423/006 (2013.01); C09J 2423/106 (2013.01); C09J 2451/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01); C09J 2479/08 (2013.01); Y10T 428/287 (2015.01); Y10T 428/2813 (2015.01); Y10T 428/2848 (2015.01);
Abstract

The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.

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