The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Aug. 31, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Randall Dean West, Vancouver, WA (US);

Matt G Driggers, Vancouver, WA (US);

Brent Ewald, Vancouver, WA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/329 (2017.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); B29C 64/245 (2017.01); B29C 64/357 (2017.01); B29C 64/393 (2017.01); B33Y 50/02 (2015.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
B29C 64/329 (2017.08); B29C 64/245 (2017.08); B29C 64/357 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

According to one example, there is provided a method of distributing build material in a 3D printing system. The method comprises moving a build material support positioned below a hopper, the movement to cause build material stored in the hopper to be deposited on the build material support, and moving a recoater to spread build material from the build material support over a build platform to form a layer of build material thereon, and to return any excess build material back to the build material support.


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