The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 19, 2021
Filed:
Jun. 07, 2018
Applicant:
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Inventors:
Takayuki Shimizu, Tokyo, JP;
Akihisa Okuda, Tokyo, JP;
Ryota Ozaki, Tokyo, JP;
Shoya Mano, Tokyo, JP;
Masahiko Shimizu, Tokyo, JP;
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/30 (2006.01); B29C 33/50 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 33/505 (2013.01); B29C 70/30 (2013.01); B29K 2105/0872 (2013.01); B29K 2307/04 (2013.01); B29L 2031/3076 (2013.01);
Abstract
A flexible mandrel for molding a composite material containing a thermosetting resin includes: a body including a contact surface configured to come into contact with the composite material during molding and a non-contact surface configured not to come into contact with the composite material during molding; and at least one hole formed from the non-contact surface toward an inside of the body.