The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Apr. 27, 2018
Applicant:

Dynamic Material Systems, Llc, Oviedo, FL (US);

Inventors:

Walter Sherwood, Ballston Lake, NY (US);

Matthew Stephens, Orlando, FL (US);

Arnold Hill, Orlando, FL (US);

William Easter, Chuluota, FL (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B28B 1/00 (2006.01); C08L 83/16 (2006.01); C04B 35/565 (2006.01); C04B 35/01 (2006.01); C04B 35/632 (2006.01); C04B 40/02 (2006.01); C09C 1/00 (2006.01); C09C 1/48 (2006.01); C09C 1/64 (2006.01); C08L 83/04 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); C04B 35/58 (2006.01); C04B 35/74 (2006.01);
U.S. Cl.
CPC ...
B28B 1/001 (2013.01); C04B 35/01 (2013.01); C04B 35/565 (2013.01); C04B 35/58085 (2013.01); C04B 35/632 (2013.01); C04B 35/74 (2013.01); C04B 40/02 (2013.01); C08L 83/04 (2013.01); C08L 83/16 (2013.01); C09C 1/0009 (2013.01); C09C 1/48 (2013.01); C09C 1/64 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); C04B 2235/3418 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/5454 (2013.01); C04B 2237/704 (2013.01);
Abstract

Methods, processes, systems, devices and apparatus are provided for additive manufacture resulting in the 3D printing of ceramic materials and components with a thickness greater than three millimeters (3 mm). A sulfur-free 3D printable formulation comprises a liquid inorganic polymer resin using Stereolithograpy (SLA) printers and Digital Light Processing (DLP) curing of the polymer resin via the chemical bonding of the materials rather than sintering. Thus, the process has shorter manufacturing intervals, significantly lower energy use and produces larger scale ceramic components having less linear shrinkage, less mass loss and high ceramic yield with no corrosive sulfur compounds present in the ceramic component.


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