The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Apr. 23, 2018
Applicant:

Desktop Metal, Inc., Burlington, MA (US);

Inventors:

Ricardo Chin, Shrewsbury, MA (US);

Blake Z. Reeves, Chelsea, MA (US);

Assignee:

Desktop Metal, Inc., Burlington, MA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 19/4099 (2006.01); B33Y 50/00 (2015.01); B22F 10/20 (2021.01); B33Y 50/02 (2015.01); B28B 17/00 (2006.01); B28B 1/00 (2006.01); B29C 64/386 (2017.01); B29C 64/40 (2017.01); H04N 1/409 (2006.01); B33Y 10/00 (2015.01); B29C 64/10 (2017.01); B22F 10/30 (2021.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B29C 64/386 (2017.08); B29C 64/40 (2017.08); B33Y 50/00 (2014.12); B33Y 50/02 (2014.12); G05B 19/4099 (2013.01); H04N 1/4092 (2013.01); B22F 10/30 (2021.01); B29C 64/10 (2017.08); B33Y 10/00 (2014.12); G05B 2219/35134 (2013.01); G05B 2219/49007 (2013.01);
Abstract

Mold lock is remediated by performing a layer-by-layer, two-dimensional analysis to identify unconstrained removal paths for any support structure or material within each two-dimensional layer, and then ensuring that aligned draw paths are present for all adjacent layers, all as more specifically described herein. Where locking conditions are identified, a sequence of modification rules are then applied, such as by breaking support structures into multiple, independently removable pieces. By addressing mold lock as a series of interrelated two-dimensional geometric problems, and reserving three-dimensional remediation strategies for more challenging, complex mold lock conditions, substantial advantages can accrue in terms of computational speed and efficiency.


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