The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Jan. 13, 2017
Applicant:

Heraeus Additive Manufacturing Gmbh, Hanau, DE;

Inventors:

Łukasz Żrodowski, Gdańsk, PL;

Krzyztof Jan Kurzydłowski, Warsaw, PL;

Wojciech Świȩszkowski, Warsaw, PL;

Bartlomiej Wysocki, Warsaw, PL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); B33Y 70/00 (2020.01); B33Y 10/00 (2015.01); B22F 10/36 (2021.01); B23K 26/082 (2014.01); B23K 26/342 (2014.01); B23K 103/16 (2006.01); B23K 26/00 (2014.01); B23K 26/06 (2014.01); C22C 45/00 (2006.01); C22C 45/08 (2006.01); C22C 45/10 (2006.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 10/36 (2021.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B22F 2999/00 (2013.01); B23K 26/0006 (2013.01); B23K 26/0626 (2013.01); B23K 26/082 (2015.10); B23K 26/342 (2015.10); B23K 2103/16 (2018.08); C22C 45/008 (2013.01); C22C 45/08 (2013.01); C22C 45/10 (2013.01); C22C 2200/02 (2013.01); C22C 2202/02 (2013.01); Y02P 10/25 (2015.11);
Abstract

A method for additive manufacturing of three-dimensional objects from metallic glasses utilizing a process of melting of successive layers of the starting material by a laser beam or an electron beam. The method includes steps such that every material layer is melted twice, using parameters which yield a crystalline melt trace in the first melting, and the successively melted beam paths contact with one another, while in the second melting, parameters yielding an amorphous melt trace are used, and the successively remelted paths or spots do not come in contact with one another, and/or between the scanning of successive paths or spots, an interval not shorter than 10 ms is maintained, the surface power density in the first remelting being lower than in the second remelting.


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