The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 19, 2021

Filed:

Jan. 05, 2018
Applicant:

Safran, Paris, FR;

Inventors:

Rabih Khazaka, Moissy-Cramayel, FR;

Stéphane Azzopardi, Moissy-Cramayel, FR;

Donatien Henri Edouard Martineau, Moissy-Cramayel, FR;

Assignee:

SAFRAN, Paris, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); A61K 38/01 (2006.01); A61K 31/202 (2006.01); A61K 35/741 (2015.01); A61K 31/716 (2006.01); A61K 31/702 (2006.01); A23L 33/18 (2016.01); A23L 33/125 (2016.01); A23L 33/19 (2016.01); A23L 33/12 (2016.01); A61K 45/06 (2006.01);
U.S. Cl.
CPC ...
A61K 38/018 (2013.01); A23L 33/12 (2016.08); A23L 33/125 (2016.08); A23L 33/18 (2016.08); A23L 33/19 (2016.08); A61K 31/202 (2013.01); A61K 31/702 (2013.01); A61K 31/716 (2013.01); A61K 35/741 (2013.01); A61K 45/06 (2013.01); H01L 23/49513 (2013.01); H01L 23/49568 (2013.01); A23V 2002/00 (2013.01);
Abstract

A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.


Find Patent Forward Citations

Loading…