The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 12, 2021

Filed:

Mar. 13, 2020
Applicant:

Stemco Co., Ltd., Cheongju-si, KR;

Inventors:

Sang Chul Lee, Cheongju-si, KR;

Hyo Jin Park, Sejong, KR;

Assignee:

STEMCO CO., LTD., Cheongju-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/0271 (2013.01); H05K 1/116 (2013.01); H05K 1/184 (2013.01); H05K 2201/09409 (2013.01); H05K 2201/10863 (2013.01);
Abstract

Disclosed herein are a circuit board and a method of fabricating the same. The circuit board includes: a base substrate having a device mount area defined thereon; a first wiring pattern formed on a first surface of the base substrate; a dummy pattern formed on the base substrate, wherein at least a part of the device mount area is filled with the dummy pattern; a first protective layer covering the first wiring pattern and the dummy pattern; and a lead pattern formed on the first protective layer, wherein the lead pattern is extended to the device mount area.


Find Patent Forward Citations

Lee, Sang. (2021). Circuit board and method for manufacturing same (U.S. Patent No. 11147160). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11147160

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…